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The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded Gull Wing type devices.ģIPC C: Minimum (Least) Land Protrusion – High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well.ĢIPC B: Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. If you consider tolerance settings, units, line-widths, pad shapes, rotations, and many dozens of other settings (all configurable with the PCB Footprint Expert), you can create over 1,800 variations of ONE SINGLE library! We empower you to quickly build high-quality standard libraries to meet your specific needs.ġIPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices. We built the Footprint Expert around the notion that there are as many unique PCB library needs as there are users.
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* Access to the POD database is available for $300/year, download limit is 500 parts per month.